Its core principle is based on the shear force of a viscous medium under unidirectional motion to remove material, thereby achieving an ultra-smooth, damage-free processing effect. It is particularly suitable for solving complex curved surfaces, microstructures, and hard and brittle materials that are difficult to handle with traditional polishing methods.
High surface accuracy: Preserves and even corrects the original surface shape of the workpiece without introducing new mid-to-high frequency errors.
Ultra-smooth surface: Achieves sub-nanometer level (Ra < 1 nm) surface roughness.
No subsurface damage: The flexible processing method virtually eliminates microcracks or plastic deformation layers on the workpiece surface, crucial for optical components and semiconductor devices.
Good consistency: Achieves highly consistent polishing results across the entire processed surface, whether planar, spherical, or aspherical.
High processing efficiency: Compared to traditional manual polishing or some computer-controlled small tool polishing, it offers higher material removal rates, especially advantageous in mass production.
High degree of automation: Process parameters are program-controlled, reducing the impact of human factors, ensuring stable product quality, and relatively lower operator skill requirements.
